PICMG Systems & Technology

E-Letter
November 2018

 
 
 
 
 
 
This edition is sponsored by
 
nVent Schroff
Elma Electronic
Amphenol-BSI
Embedded World 2019
 
 
 
 
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PRESIDENT'S CORNER
JESSICA ISQUITH, PRESIDENT OF PICMG
 
PICMG has begun several exciting new initiatives during the past year, within an atmosphere of strong collaboration that will only help in the success of each. The rapid adoption of industrial IoT (IIoT) and growing requirements in the Computer on Module (COM) market have led to the formation of multiple new committees, groups, and alliances within PICMG and the industry at large - collaboration in action.
 
 
 
 
 
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SENSORS EXPO
JUSTIN MOLL, VICE PRESIDENT OF MARKETING AT PICMG
 
Sensors Expo was held in San Jose from June 26 to 28, 2018. It was great to see a trade show with growing attendance and enthusiasm. Regardless of the type of sensor vendor on display, the trend to connect sensor technologies was widespread. 
 
 
 
 
 
SPONSORED PRODUCT
nVent
 
nVent
 
nVent Pigeon Point Management Components
 
SPONSORED PRODUCT
Elma Electronic
 
Elma Electronic
 
Rugged, Isolated Power Supplies for Small Form Factor Systems on Ground Vehicle and Aircraft Applications
 
SPONSORED PRODUCT
Advanced Micro Peripherals
 
Advanced Micro Peripherals
 
HDCorder-SDI – CompactPCI Serial HD-SDI H.264 Video Encoder
 
 
 
 
 
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TECHNOLOGY FOCUS
JESSICA ISQUITH, PRESIDENT OF PICMG
 
The Computer on Module (COM) market is expected to grow significantly over the next five-plus years, according to multiple market research studies. Within the COM market, COM Express is the recognized leader, with its strongest areas of growth being IIoT [industrial Internet of Things] and adoption in rugged environments, including drones, military, and transportation.
 
 
 
 
 
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APPLICATION FEATURE
DOUG SANDY, VICE PRESIDENT OF TECHNOLOGY FOR PICMG
 
The Internet of Things (IoT) promises to transform the way that we deploy industrial applications by combining the best practices from the IT space with cloud-based analytics and machine learning.
 
 
 
 
 
SPONSORED PRODUCT
ALPHI Technology Corporation
 
ALPHI Technology Corporation
 
User Reconfigurable FPGA-Based RS-422/485 or 32 Channel LVTTL PCIe Mini Board
 
SPONSORED PRODUCT
Verotec
 
Verotec
 
Eleven New Integrated Development Systems
 
SPONSORED PRODUCT
Amphenol Backplane & System Integration
 
Amphenol Backplane & System Integration
 
Amphenol Backplane & System Integration
 
 
 
 
 
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TECHNOLOGY FOCUS
CHRISTIAN EDER, CONGATEC AG
 
With the newly revised (Version 3.0) iteration of the most successful computer-on-module (COM) standard, a new pinout type is added to extend the reach of COM Express to server type applications.
 
 
 
 
 
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APPLICATION FEATURE
JUSTIN MOLL, VICE PRESIDENT OF MARKETING AT PICMG
 
MicroTCA is a highly versatile backplane-based architecture that is utilized in a wide variety of applications. With a high-speed connector, compact size, hot-swappability, and 99.9999 percent achievable uptime, it's a powerful architecture. 
 
 
 
 
 
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SPONSORED WHITE PAPER
ABACO SYSTEMS
 
On the modern battlefield, dominating the electromagnetic spectrum is increasingly important. In order to do so, radar, SIGINT and electronic warfare systems must be able to cover wider and wider bands of the spectrum. 
 
 
 
 
 
 
Webcast
 
 

Sponsored by: Core Avionics & Industrial Inc., Curtiss Wright, Wind
Date: November 14, 11:00 a.m. ET

 
For additional Webcasts, check out the Broadcast Archive.
 
 
 
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